Project Description

2×2 zQSFP+ Receptacle with Cage Assembly, Press-Fit, ESF150806C (Free Sample) 

PS: Z four channel small Plus (zQSFP+) solution for high density interconnect applications designed to meet the QSFP28 SFF-8665 standard.

Technical Parameters:

  • General Characteristics
    ROHS compliant
    Industry standard footprint
    Industry standard EIA-364
  • Mechanical Characteristics
    Durability: 250 mating cycles min
  • Electrical Characteristics
    Hot swappable
    Operating voltage: 3.3V
    Operating current: 0.5A
    Differential impedance: 100Ω±10Ω
    DWV: 300V AC
    Insulation resistance: 1000MΩ min
    EMI spring fingers for superior EMI performanc
    Data Rate (Max) : 25Gb/s
  • Options
    Dust cover
    Heat sink
    Round light pipe
  • Packaging
    Tape and reel packaging: Connector
    Tray packing: Cage


  • Materials
    Base Material: Copper Alloy
    Plating: Nickel
    Heat sink: Aluminum Alloy
    Heat sink clip: Stainless Steel
    EMI spring finger: Copper Alloy with Nickel plating
    Dust cover: Thermoplastic
    Contact base material: Copper Alloy
    Contact plating: Gold on mating area, matte tin on termination and grounding tabs
    Housings: Glass reinforced, Lead-free solder reflow process compatible thermoplastic, UL94V-0 Rated
  • Temperature rating
    Operating temperature: -55℃~+85℃
    Storage temperature: -55℃~+85℃
  • zQSFP+ Cage Configurations 1xN 2xN (rows x ports per row)
    1×1  1×4  1×6  2×1  2×2  2×3

Product Drawing (PDF Download Available):

2×2 zQSFP+ Receptacle with Cage Assembly, Press-Fit, ESF150806C, QSFP28 Cage 

Download Link: